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Reflow oven with Wi-Fi connectivity

Author

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  • Ovidiu-Andrei Barb

    (Computer Science and Electrical Engineering Department, “Lucian Blaga” University of Sibiu, Romania)

Abstract

This paper will address a theme that highlights the role of an electrical equipment in the electrical industry, focusing on the process of soldering components onto the surface of printed circuit boards. The choice of the theme “Reflow Oven with Wi-Fi Connectivity” was driven by the desire to create a system with practical and applicative outcomes. The aim is to develop equipment that facilitates the soldering process of Surface Mounted Device (SMD) components. Such an automated system is valuable in the production of small batches of equipment, such as electronic modules for prototypes or various applications. The equipment or electronic module aims to depict a Printed Circuit Board (PCB) on which both Surface Mounted Devices (SMD) and Through Hole Technology (THT) components are mounted. Throughout the paper, the implementation of an automated system capable of carrying out the soldering process for SMD components will be discussed.

Suggested Citation

  • Ovidiu-Andrei Barb, 2024. "Reflow oven with Wi-Fi connectivity," International Journal of Advanced Statistics and IT&C for Economics and Life Sciences, Sciendo, vol. 14(1), pages 157-167.
    • Handle: RePEc:vrs:ijsiel:v:14:y:2024:i:1:p:157-167:n:1003
    DOI: 10.2478/ijasitels-2024-0003
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    Keywords

    IoT; reflow oven; Wi-Fi; soldering; PCB;
    All these keywords.

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