IDEAS home Printed from https://ideas.repec.org/a/taf/tewaxx/v36y2022i16p2320-2340.html
   My bibliography  Save this article

Noise mitigation in high-speed PCB applications: experimental verification and validation of electromagnetic band gap filters

Author

Listed:
  • Y. Uma Maheswari
  • A. Amudha
  • L. Ashok Kumar

Abstract

Electromagnetic noise (EMI) affects efficiency of a gadget, proximity devices and human beings, necessitating the noise mitigation. Introduction of Electromagnetic Band Gap (EBG) structure in PCB as plane pairs helps for high-speed operations. In this paper, the planar L-bridge embedded pattern-type EBG structure is designed to mitigate the noise. Experimental verification of the designed EBG type with various geometrical parameters is carried out by altering the geometrical parameters of the unit cell with 18 cases. All the cases are simulated for the frequency sweep 0.1–10 GHz. Simulation results are compared with theoretical calculations and measurement results. It is found that they are in good agreement. The depth in noise levels can be efficiently altered by changing air gap, line length and unit cell width. In order to validate the EBG, a continuous plane is considered and found that EBG helps to mitigate the noise level in the higher frequency.

Suggested Citation

  • Y. Uma Maheswari & A. Amudha & L. Ashok Kumar, 2022. "Noise mitigation in high-speed PCB applications: experimental verification and validation of electromagnetic band gap filters," Journal of Electromagnetic Waves and Applications, Taylor & Francis Journals, vol. 36(16), pages 2320-2340, November.
    • Handle: RePEc:taf:tewaxx:v:36:y:2022:i:16:p:2320-2340
    DOI: 10.1080/09205071.2022.2076157
    as

    Download full text from publisher

    File URL: http://hdl.handle.net/10.1080/09205071.2022.2076157
    Download Restriction: Access to full text is restricted to subscribers.
    File URL: https://libkey.io/10.1080/09205071.2022.2076157?utm_source=ideas
    LibKey link: if access is restricted and if your library uses this service, LibKey will redirect you to where you can use your library subscription to access this item
    ---><---

    As the access to this document is restricted, you may want to search for a different version of it.

    More about this item

    Statistics

    Access and download statistics

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:taf:tewaxx:v:36:y:2022:i:16:p:2320-2340. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Chris Longhurst (email available below). General contact details of provider: http://www.tandfonline.com/tewa .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.