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Graphene and two-dimensional materials for silicon technology

Author

Listed:
  • Deji Akinwande

    (The University of Texas at Austin)

  • Cedric Huyghebaert

    (IMEC)

  • Ching-Hua Wang

    (Stanford University)

  • Martha I. Serna

    (The University of Texas at Austin)

  • Stijn Goossens

    (The Barcelona Institute of Science and Technology, Castelldefels (Barcelona))

  • Lain-Jong Li

    (Corporate Research, Taiwan Semiconductor Manufacturing Company (TSMC))

  • H.-S. Philip Wong

    (Stanford University
    Corporate Research, Taiwan Semiconductor Manufacturing Company (TSMC))

  • Frank H. L. Koppens

    (The Barcelona Institute of Science and Technology, Castelldefels (Barcelona)
    ICREA–Institució Catalana de Recerça i Estudis Avancats)

Abstract

The development of silicon semiconductor technology has produced breakthroughs in electronics—from the microprocessor in the late 1960s to early 1970s, to automation, computers and smartphones—by downscaling the physical size of devices and wires to the nanometre regime. Now, graphene and related two-dimensional (2D) materials offer prospects of unprecedented advances in device performance at the atomic limit, and a synergistic combination of 2D materials with silicon chips promises a heterogeneous platform to deliver massively enhanced potential based on silicon technology. Integration is achieved via three-dimensional monolithic construction of multifunctional high-rise 2D silicon chips, enabling enhanced performance by exploiting the vertical direction and the functional diversification of the silicon platform for applications in opto-electronics and sensing. Here we review the opportunities, progress and challenges of integrating atomically thin materials with silicon-based nanosystems, and also consider the prospects for computational and non-computational applications.

Suggested Citation

  • Deji Akinwande & Cedric Huyghebaert & Ching-Hua Wang & Martha I. Serna & Stijn Goossens & Lain-Jong Li & H.-S. Philip Wong & Frank H. L. Koppens, 2019. "Graphene and two-dimensional materials for silicon technology," Nature, Nature, vol. 573(7775), pages 507-518, September.
    • Handle: RePEc:nat:nature:v:573:y:2019:i:7775:d:10.1038_s41586-019-1573-9
    DOI: 10.1038/s41586-019-1573-9
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    3. Yikai Zheng & Harikrishnan Ravichandran & Thomas F. Schranghamer & Nicholas Trainor & Joan M. Redwing & Saptarshi Das, 2022. "Hardware implementation of Bayesian network based on two-dimensional memtransistors," Nature Communications, Nature, vol. 13(1), pages 1-11, December.
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    14. Shuo Dong & Samuel Beaulieu & Malte Selig & Philipp Rosenzweig & Dominik Christiansen & Tommaso Pincelli & Maciej Dendzik & Jonas D. Ziegler & Julian Maklar & R. Patrick Xian & Alexander Neef & Avaise, 2023. "Observation of ultrafast interfacial Meitner-Auger energy transfer in a Van der Waals heterostructure," Nature Communications, Nature, vol. 14(1), pages 1-8, December.
    15. Fankai Zeng & Ran Wang & Wenya Wei & Zuo Feng & Quanlin Guo & Yunlong Ren & Guoliang Cui & Dingxin Zou & Zhensheng Zhang & Song Liu & Kehai Liu & Ying Fu & Jinzong Kou & Li Wang & Xu Zhou & Zhilie Tan, 2023. "Stamped production of single-crystal hexagonal boron nitride monolayers on various insulating substrates," Nature Communications, Nature, vol. 14(1), pages 1-7, December.
    16. Mengshi Yu & Congwei Tan & Yuling Yin & Junchuan Tang & Xiaoyin Gao & Hongtao Liu & Feng Ding & Hailin Peng, 2024. "Integrated 2D multi-fin field-effect transistors," Nature Communications, Nature, vol. 15(1), pages 1-11, December.
    17. Tian Zhang & Xin Guo & Pan Wang & Xinyi Fan & Zichen Wang & Yan Tong & Decheng Wang & Limin Tong & Linjun Li, 2024. "High performance artificial visual perception and recognition with a plasmon-enhanced 2D material neural network," Nature Communications, Nature, vol. 15(1), pages 1-10, December.
    18. Lingan Kong & Ruixia Wu & Yang Chen & Ying Huangfu & Liting Liu & Wei Li & Donglin Lu & Quanyang Tao & Wenjing Song & Wanying Li & Zheyi Lu & Xiao Liu & Yunxin Li & Zhiwei Li & Wei Tong & Shuimei Ding, 2023. "Wafer-scale and universal van der Waals metal semiconductor contact," Nature Communications, Nature, vol. 14(1), pages 1-8, December.
    19. Yanze Feng & Runkun Chen & Junbo He & Liujian Qi & Yanan Zhang & Tian Sun & Xudan Zhu & Weiming Liu & Weiliang Ma & Wanfu Shen & Chunguang Hu & Xiaojuan Sun & Dabing Li & Rongjun Zhang & Peining Li & , 2023. "Visible to mid-infrared giant in-plane optical anisotropy in ternary van der Waals crystals," Nature Communications, Nature, vol. 14(1), pages 1-8, December.
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    22. Max C. Lemme & Deji Akinwande & Cedric Huyghebaert & Christoph Stampfer, 2022. "2D materials for future heterogeneous electronics," Nature Communications, Nature, vol. 13(1), pages 1-5, December.

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