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Extreme creep resistance in a microstructurally stable nanocrystalline alloy

Author

Listed:
  • K. A. Darling

    (Army Research Laboratory, Aberdeen Proving Ground)

  • M. Rajagopalan

    (School of Engineering of Matter, Transport, and Energy, Arizona State University)

  • M. Komarasamy

    (University of North Texas)

  • M. A. Bhatia

    (School of Engineering of Matter, Transport, and Energy, Arizona State University)

  • B. C. Hornbuckle

    (Army Research Laboratory, Aberdeen Proving Ground)

  • R. S. Mishra

    (University of North Texas)

  • K. N. Solanki

    (School of Engineering of Matter, Transport, and Energy, Arizona State University)

Abstract

A nanocrystalline copper–tantalum alloy with high strength and extremely high-temperature creep resistance is achieved via a processing method that creates clusters of atoms within the alloy that pin grain boundaries.

Suggested Citation

  • K. A. Darling & M. Rajagopalan & M. Komarasamy & M. A. Bhatia & B. C. Hornbuckle & R. S. Mishra & K. N. Solanki, 2016. "Extreme creep resistance in a microstructurally stable nanocrystalline alloy," Nature, Nature, vol. 537(7620), pages 378-381, September.
    • Handle: RePEc:nat:nature:v:537:y:2016:i:7620:d:10.1038_nature19313
    DOI: 10.1038/nature19313
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    Cited by:

    1. Hai Wang & Wei Song & Mingfeng Liu & Shuyuan Zhang & Ling Ren & Dong Qiu & Xing-Qiu Chen & Ke Yang, 2022. "Manufacture-friendly nanostructured metals stabilized by dual-phase honeycomb shell," Nature Communications, Nature, vol. 13(1), pages 1-8, December.
    2. Shufen Chu & Pan Liu & Yin Zhang & Xiaodong Wang & Shuangxi Song & Ting Zhu & Ze Zhang & Xiaodong Han & Baode Sun & Mingwei Chen, 2022. "In situ atomic-scale observation of dislocation climb and grain boundary evolution in nanostructured metal," Nature Communications, Nature, vol. 13(1), pages 1-8, December.

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