Author
Listed:
- Zhihao Bao
(School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA)
- Michael R. Weatherspoon
(School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA)
- Samuel Shian
(School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA)
- Ye Cai
(School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA)
- Phillip D. Graham
(School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA)
- Shawn M. Allan
(School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA)
- Gul Ahmad
(School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA)
- Matthew B. Dickerson
(School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA)
- Benjamin C. Church
(School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA)
- Zhitao Kang
(School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA)
- Harry W. Abernathy III
(School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA)
- Christopher J. Summers
(School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA)
- Meilin Liu
(School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA)
- Kenneth H. Sandhage
(School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA)
Abstract
Silicon in good shape A low-temperature method of reducing silica (SiO2) to silicon (Si) could open up a multitude of new applications for micro-scale structures previously available only as the insulating oxide, such as diatom microshells and self-assembled structures made to order. The method converts silica to silicon at 650 °C — compared with the 2,000 °C or so needed for approaches involving molten silicon — at the same time retaining the original silica architecture. Silicon replicas, like the 14 µm-long example pictured, could find applications as sensors, and in the worlds of electronics, optics and biomedicine.
Suggested Citation
Zhihao Bao & Michael R. Weatherspoon & Samuel Shian & Ye Cai & Phillip D. Graham & Shawn M. Allan & Gul Ahmad & Matthew B. Dickerson & Benjamin C. Church & Zhitao Kang & Harry W. Abernathy III & Chris, 2007.
"Chemical reduction of three-dimensional silica micro-assemblies into microporous silicon replicas,"
Nature, Nature, vol. 446(7132), pages 172-175, March.
Handle:
RePEc:nat:nature:v:446:y:2007:i:7132:d:10.1038_nature05570
DOI: 10.1038/nature05570
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