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Adhesive curing through low-voltage activation

Author

Listed:
  • Jianfeng Ping

    (School of Materials Science and Engineering, College of Engineering, Nanyang Technological University
    School of Biosystems Engineering and Food Science, Zhejiang University)

  • Feng Gao

    (School of Materials Science and Engineering, College of Engineering, Nanyang Technological University)

  • Jian Lin Chen

    (School of Materials Science and Engineering, College of Engineering, Nanyang Technological University)

  • Richard D. Webster

    (School of Physical and Mathematical Sciences, Nanyang Technological University)

  • Terry W. J. Steele

    (School of Materials Science and Engineering, College of Engineering, Nanyang Technological University)

Abstract

Instant curing adhesives typically fall within three categories, being activated by either light (photocuring), heat (thermocuring) or chemical means. These curing strategies limit applications to specific substrates and can only be activated under certain conditions. Here we present the development of an instant curing adhesive through low-voltage activation. The electrocuring adhesive is synthesized by grafting carbene precursors on polyamidoamine dendrimers and dissolving in aqueous solvents to form viscous gels. The electrocuring adhesives are activated at −2 V versus Ag/AgCl, allowing tunable crosslinking within the dendrimer matrix and on both electrode surfaces. As the applied voltage discontinued, crosslinking immediately terminated. Thus, crosslinking initiation and propagation are observed to be voltage and time dependent, enabling tuning of both material properties and adhesive strength. The electrocuring adhesive has immediate implications in manufacturing and development of implantable bioadhesives.

Suggested Citation

  • Jianfeng Ping & Feng Gao & Jian Lin Chen & Richard D. Webster & Terry W. J. Steele, 2015. "Adhesive curing through low-voltage activation," Nature Communications, Nature, vol. 6(1), pages 1-9, November.
    • Handle: RePEc:nat:natcom:v:6:y:2015:i:1:d:10.1038_ncomms9050
    DOI: 10.1038/ncomms9050
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