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Oriented Bi2Te3-based films enabled high performance planar thermoelectric cooling device for hot spot elimination

Author

Listed:
  • Guoying Dong

    (Chinese Academy of Sciences)

  • Jianghe Feng

    (Chinese Academy of Sciences)

  • Guojuan Qiu

    (Chinese Academy of Sciences)

  • Yuxuan Yang

    (Xi’an Jiaotong University)

  • Qiyong Chen

    (Shanghai University)

  • Yang Xiong

    (Chinese Academy of Sciences)

  • Haijun Wu

    (Xi’an Jiaotong University)

  • Yifeng Ling

    (Chinese Academy of Sciences)

  • Lili Xi

    (Shanghai University)

  • Chen Long

    (Chinese Academy of Sciences)

  • Jibao Lu

    (Chinese Academy of Sciences)

  • Yixin Qiao

    (Chinese Academy of Sciences)

  • Guijuan Li

    (Chinese Academy of Sciences)

  • Juan Li

    (Chinese Academy of Sciences)

  • Ruiheng Liu

    (Chinese Academy of Sciences)

  • Rong Sun

    (Chinese Academy of Sciences)

Abstract

Film-thermoelectric cooling devices are expected to provide a promising active thermal management solution with the continues increase of the power density of integrated circuit chips and other electronic devices. However, because the microstructure-related performance of thermoelectric films has not been perfectly matched with the device configuration, the potential of planar devices on chip heat dissipation has still not been fully exploited. Here, by liquid Te assistant growth method, highly (00 l) orientated Bi2Te3-based films which is comparable to single crystals are obtained in polycrystal films in this work. The high mobility stem from high orientation and low lattice thermal conductivity resulting from excess Te induced staggered stacking faults leads to high in-plane zT values ~1.53 and ~1.10 for P-type Bi0.4Sb1.6Te3 and N-type Bi2Te3 films, respectively. The planar devices basing on the geometrically designed high orientation films produce a remarkable temperature reduction of ~8.2 K in the hot spot elimination experiment, demonstrating the great benefit of Te assistant growth method for oriented planar Bi2Te3 films and planar devices devices design, and also bring great enlightenment to the next generation active thermal management for integrated circuits.

Suggested Citation

  • Guoying Dong & Jianghe Feng & Guojuan Qiu & Yuxuan Yang & Qiyong Chen & Yang Xiong & Haijun Wu & Yifeng Ling & Lili Xi & Chen Long & Jibao Lu & Yixin Qiao & Guijuan Li & Juan Li & Ruiheng Liu & Rong S, 2024. "Oriented Bi2Te3-based films enabled high performance planar thermoelectric cooling device for hot spot elimination," Nature Communications, Nature, vol. 15(1), pages 1-10, December.
    • Handle: RePEc:nat:natcom:v:15:y:2024:i:1:d:10.1038_s41467-024-54017-3
    DOI: 10.1038/s41467-024-54017-3
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    References listed on IDEAS

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    1. Liming Wang & Zimeng Zhang & Yuchen Liu & Biran Wang & Lei Fang & Jingjing Qiu & Kun Zhang & Shiren Wang, 2018. "Exceptional thermoelectric properties of flexible organic−inorganic hybrids with monodispersed and periodic nanophase," Nature Communications, Nature, vol. 9(1), pages 1-8, December.
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