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Wafer dicing strategic planning technique for clustered BioMEMS devices

Author

Listed:
  • Arvind Chandrasekaran
  • Muthukumaran Packirisamy

Abstract

The advent of Micro-Electro-Mechanical Systems (MEMS) offers a tremendous potential for the synthesis of devices within smaller space. Packaging is one of the important aspects in post-processing, which is rendered easy with proper device designs and arrangement. Some of the microfabrication process technologies have in-built restrictions and design constraints because of which the device may not be readily usable for further syntheses. In this paper, a cost-effective strategic planning method is presented, which is useful in enhancing the utility of clustered MEMS devices. This technique involves strategic design and carefully monitored wafer dicing in a way so as to optimise the material loss and the utility of the device. The operations are carried out such that the functionality of any of the modules in the device is not affected. The design and fabrication techniques, along with the comprehensive post-processing operations employed in this work and biophotonic testing results, are also detailed.

Suggested Citation

  • Arvind Chandrasekaran & Muthukumaran Packirisamy, 2007. "Wafer dicing strategic planning technique for clustered BioMEMS devices," International Journal of Product Development, Inderscience Enterprises Ltd, vol. 4(3/4), pages 296-309.
    • Handle: RePEc:ids:ijpdev:v:4:y:2007:i:3/4:p:296-309
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