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Micromachining of silicon with excimer laser in air and water medium

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Listed:
  • Alok Kumar Das
  • Partha Saha

Abstract

Laser micromachining of silicon was performed by KrF excimer laser, utilising the beam energy density (fluence) in the range of 1.33-5 J/cm². Experiments were conducted on silicon wafer surface both in air and water medium. A qualitative study of the surface topography was carried out from the micrographs of the different machined spots. A mathematical model was developed to represent the process. The ablation/etch depth is found to increase rapidly with increase in laser fluence after a threshold value. The variation is nonlinear, irrespective of the surface topography and it gets a saturation value at higher fluence.

Suggested Citation

  • Alok Kumar Das & Partha Saha, 2010. "Micromachining of silicon with excimer laser in air and water medium," International Journal of Manufacturing Technology and Management, Inderscience Enterprises Ltd, vol. 21(1/2), pages 42-53.
    • Handle: RePEc:ids:ijmtma:v:21:y:2010:i:1/2:p:42-53
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