IDEAS home Printed from https://ideas.repec.org/a/ids/ijmtma/v18y2009i3p333-339.html
   My bibliography  Save this article

Finite element analysis on stress/strain in CBGA solder joint with different substrates under thermal cycle

Author

Listed:
  • Yang Ping
  • Caijun Shen

Abstract

In this paper, visco-plastic constitutive Anand equation model was used to investigate the behaviour of SnPb solder. A two-dimensional model was built to simulate the working characteristics of soldered joint structure in CBGA by using finite element method. In the meantime, some different kinds of substrates (for example Al2O3, ALN, SiC, BeO) were selected to investigate the mechanical behaviour such as stress/strain process of the solder under thermal cycle. The results shown the maximum stress and strain occurred at the outermost solder. The maximum stress occurred at lowest temperature and hardly decreased with ramp time. The results of finite element analysis also shown the solder have the minimum stress/strain when choose BeO as substrate.

Suggested Citation

  • Yang Ping & Caijun Shen, 2009. "Finite element analysis on stress/strain in CBGA solder joint with different substrates under thermal cycle," International Journal of Manufacturing Technology and Management, Inderscience Enterprises Ltd, vol. 18(3), pages 333-339.
    • Handle: RePEc:ids:ijmtma:v:18:y:2009:i:3:p:333-339
    as

    Download full text from publisher

    File URL: http://www.inderscience.com/link.php?id=26393
    Download Restriction: Access to full text is restricted to subscribers.
    ---><---

    As the access to this document is restricted, you may want to search for a different version of it.

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:ids:ijmtma:v:18:y:2009:i:3:p:333-339. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Sarah Parker (email available below). General contact details of provider: http://www.inderscience.com/browse/index.php?journalID=21 .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.