IDEAS home Printed from https://ideas.repec.org/a/ids/ijmtma/v14y2008i1-2p130-144.html
   My bibliography  Save this article

Analysing inspection frequency for wafer bumping process and an empirical study of UNISON decision framework

Author

Listed:
  • Chen-Fu Chien
  • Chih-Han Hu
  • Chi-Yung Lin

Abstract

This study aims to develop a UNISON decision framework for analysing the inspection frequency decisions for the advanced wafer bumping process. Since the accumulated values of the wafers fabricated in wafer fabs are high, process excursion and defects in bumping will cause serious loss. Thus, it is critical to determine the inspection frequency to fulfil the requirement of mass production while ensuring the yield. For validation, an empirical study was conducted in a bumping company and the results showed practical viability of the proposed approach.

Suggested Citation

  • Chen-Fu Chien & Chih-Han Hu & Chi-Yung Lin, 2008. "Analysing inspection frequency for wafer bumping process and an empirical study of UNISON decision framework," International Journal of Manufacturing Technology and Management, Inderscience Enterprises Ltd, vol. 14(1/2), pages 130-144.
    • Handle: RePEc:ids:ijmtma:v:14:y:2008:i:1/2:p:130-144
    as

    Download full text from publisher

    File URL: http://www.inderscience.com/link.php?id=17491
    Download Restriction: Access to full text is restricted to subscribers.
    ---><---

    As the access to this document is restricted, you may want to search for a different version of it.

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:ids:ijmtma:v:14:y:2008:i:1/2:p:130-144. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Sarah Parker (email available below). General contact details of provider: http://www.inderscience.com/browse/index.php?journalID=21 .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.