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Multifactor performance measure model with an application to printed circuit board industry

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  • Chuan-Chun Wu

Abstract

The research described in this paper contains two parts. The first part is to present an empirical investigation where financial index is considered to measure the printed circuit board performance. The second part is to examine the effects of financial index on sales and gross margin. The technique of Data Envelopment Analysis is utilised to derive the efficiency and multiple regression analysis to disclose the effects. There were remarkable results: (1) the averaged efficiency was 0.746 which, generally speaking, did not show a good performance, (2) PCB manufacturers in the group of Single-Sided Boards/Double-Sided Boards and Multi-Layer Boards manufacturers performed average efficiency was 0.7784, (3) PCB manufacturers in the group of Flexible Print Circuit (FPC) performed average efficiency was 0.8492, (4) current assets, the number of employees and operating expenses showed significant effects on both the sales and gross margin. Other research findings were addressed and discussed in this research also.

Suggested Citation

  • Chuan-Chun Wu, 2007. "Multifactor performance measure model with an application to printed circuit board industry," International Journal of Business Performance Management, Inderscience Enterprises Ltd, vol. 9(1), pages 43-57.
    • Handle: RePEc:ids:ijbpma:v:9:y:2007:i:1:p:43-57
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    Cited by:

    1. Charles, Vincent & Kumar, Mukesh & Irene Kavitha, S., 2012. "Measuring the efficiency of assembled printed circuit boards with undesirable outputs using data envelopment analysis," International Journal of Production Economics, Elsevier, vol. 136(1), pages 194-206.

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