IDEAS home Printed from https://ideas.repec.org/a/hin/jnlmpe/6659118.html
   My bibliography  Save this article

Finite-Element Analysis on Compressive Performance of a Novel Glue-Laminated Cornstalk Scrimber

Author

Listed:
  • Wei Tian
  • Yongmei Qian
  • Zunpeng Liu
  • Yiming Wang

Abstract

Novel glue-laminated cornstalk scrimber is a new timber substitute produced by special techniques, without damaging the original fibers in cornstalks. This novel material outperforms ordinary timber in the resistance to water, damping, insect, and fire and provides a desirable green building material. However, glue-laminated cornstalk scrimber has not been widely implemented in the building industry, because the application of cornstalk products is limited to decoration panels. With the aid of the finite-element software Abaqus, this paper simulates the glue-laminated cornstalk scrimber specimens with different slenderness ratios under axial compression and analyzes the compressive performance of such specimens. The results show that the height of glue-laminated cornstalk scrimber is negatively correlated with the buckling load and nonlinear load under axial compression and positively correlated with the transverse displacement and axial displacements induced by axial compression. The research results provide a good reference for improving the design and application of glue-laminated cornstalk scrimber.

Suggested Citation

  • Wei Tian & Yongmei Qian & Zunpeng Liu & Yiming Wang, 2020. "Finite-Element Analysis on Compressive Performance of a Novel Glue-Laminated Cornstalk Scrimber," Mathematical Problems in Engineering, Hindawi, vol. 2020, pages 1-6, December.
    • Handle: RePEc:hin:jnlmpe:6659118
    DOI: 10.1155/2020/6659118
    as

    Download full text from publisher

    File URL: http://downloads.hindawi.com/journals/MPE/2020/6659118.pdf
    Download Restriction: no
    File URL: http://downloads.hindawi.com/journals/MPE/2020/6659118.xml
    Download Restriction: no
    File URL: https://libkey.io/10.1155/2020/6659118?utm_source=ideas
    LibKey link: if access is restricted and if your library uses this service, LibKey will redirect you to where you can use your library subscription to access this item
    ---><---

    More about this item

    Statistics

    Access and download statistics

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:hin:jnlmpe:6659118. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Mohamed Abdelhakeem (email available below). General contact details of provider: https://www.hindawi.com .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.