Effects of Sudden Temperature Drop on Stress at Rapidly Repaired Bonding Interface of Pavement

The numerical simulations were employed to establish an edge-corner repair model with magnesium phosphate cement (MPC) concrete as the repair material and ordinary Portland cement concrete as the old pavement. After the simulation of repair construction by using MPC concrete with different coarse aggregates, the effect of sudden temperature drop during the stable stage of hydration reaction on the stress distribution at each bonding interface was analyzed. The numerical calculations indicate that the sudden temperature drop led to temperature-induced stress on the bonding interfaces. The stress distribution at each bonding interface was obtained and the maximum principal stress at each bonding interface was at the intersection angle of three bonding interfaces. The relationship between the temperature and stress at each bonding interface was found when different coarse aggregates were used to prepare the repairing material. Also, the effect of different coarse aggregates on the bonding interface of the repairing material was obtained when basalt was the coarse aggregate of old concrete. The stability of bonding surface from best to worst was as follows: basalt > limestone > granite > conglomerate > sandstone > quartzite.