IDEAS home Printed from https://ideas.repec.org/a/hin/jnlamp/1250343.html
   My bibliography  Save this article

Dynamic Thermal Response of Multiple Parallel Cracks in a Half Plane under General Transient Thermal Loading

Author

Listed:
  • Mahsa Nourazar
  • Weilin Yang
  • Zengtao Chen
  • S. A. Edalatpanah

Abstract

Understanding the dynamic thermal response of materials is crucial for designing effective thermal protection systems, particularly in extreme thermal environments such as transient thermal loading, extremely low/high temperature, etc. This study investigates the dynamic thermal response of a half plane containing multiple parallel cracks under transient thermal loading using a non-Fourier, hyperbolic heat conduction model. Our findings highlight significant deviations from traditional Fourier models, enhancing the predictive capabilities for designing thermal protection systems in extreme thermal environments. The cracks are modeled as distributions of thermal dislocations, with densities determined through Fourier and Laplace transforms. By solving the resulting singular integral equations, we calculate the temperature gradient intensity factors across multiple scenarios. Additionally, we examine the effects of thermal relaxation time, loading parameters, and crack spacing on the thermal intensity factors, both in transient and steady-state conditions. This research confirms the robustness of the hyperbolic model and its practical implications for thermal analysis in engineering applications.

Suggested Citation

  • Mahsa Nourazar & Weilin Yang & Zengtao Chen & S. A. Edalatpanah, 2024. "Dynamic Thermal Response of Multiple Parallel Cracks in a Half Plane under General Transient Thermal Loading," Advances in Mathematical Physics, Hindawi, vol. 2024, pages 1-12, September.
  • Handle: RePEc:hin:jnlamp:1250343
    DOI: 10.1155/2024/1250343
    as

    Download full text from publisher

    File URL: http://downloads.hindawi.com/journals/amp/2024/1250343.pdf
    Download Restriction: no

    File URL: http://downloads.hindawi.com/journals/amp/2024/1250343.xml
    Download Restriction: no

    File URL: https://libkey.io/10.1155/2024/1250343?utm_source=ideas
    LibKey link: if access is restricted and if your library uses this service, LibKey will redirect you to where you can use your library subscription to access this item
    ---><---

    More about this item

    Statistics

    Access and download statistics

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:hin:jnlamp:1250343. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Mohamed Abdelhakeem (email available below). General contact details of provider: https://www.hindawi.com .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.