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Application of a Heat Flux Sensor in Wind Power Electronics

Author

Listed:
  • Elvira Baygildina

    (Department of Electrical Engineering, Lappeenranta University of Technology, P.O. Box 20, Lappeenranta FI-53851, Finland)

  • Liudmila Smirnova

    (Department of Electrical Engineering, Lappeenranta University of Technology, P.O. Box 20, Lappeenranta FI-53851, Finland)

  • Kirill Murashko

    (Department of Electrical Engineering, Lappeenranta University of Technology, P.O. Box 20, Lappeenranta FI-53851, Finland)

  • Raimo Juntunen

    (Department of Electrical Engineering, Lappeenranta University of Technology, P.O. Box 20, Lappeenranta FI-53851, Finland)

  • Andrey Mityakov

    (Department of Electrical Engineering, Lappeenranta University of Technology, P.O. Box 20, Lappeenranta FI-53851, Finland)

  • Mikko Kuisma

    (Department of Electrical Engineering, Lappeenranta University of Technology, P.O. Box 20, Lappeenranta FI-53851, Finland)

  • Olli Pyrhönen

    (Department of Electrical Engineering, Lappeenranta University of Technology, P.O. Box 20, Lappeenranta FI-53851, Finland)

  • Pasi Peltoniemi

    (Department of Electrical Engineering, Lappeenranta University of Technology, P.O. Box 20, Lappeenranta FI-53851, Finland)

  • Katja Hynynen

    (Department of Electrical Engineering, Lappeenranta University of Technology, P.O. Box 20, Lappeenranta FI-53851, Finland)

  • Vladimir Mityakov

    (Department of Thermodynamics and Heat Transfer, Saint-Petersburg State Polytechnical University, Polytechnicheskaya 29, Saint-Petersburg 195251, Russia)

  • Sergey Sapozhnikov

    (Department of Thermodynamics and Heat Transfer, Saint-Petersburg State Polytechnical University, Polytechnicheskaya 29, Saint-Petersburg 195251, Russia)

Abstract

This paper proposes and investigates the application of the gradient heat flux sensor (GHFS) for measuring the local heat flux in power electronics. Thanks to its thinness, the sensor can be placed between the semiconductor module and the heat sink. The GHFS has high sensitivity and yields direct measurements without an interruption to the normal power device operation, which makes it attractive for power electronics applications. The development of systems for monitoring thermal loading and methods for online detection of degradation and failure of power electronic devices is a topical and crucial task. However, online condition monitoring (CM) methods, which include heat flux sensors, have received little research attention so far. In the current research, an insulated-gate bipolar transistor (IGBT) module-based test setup with the GHFS implemented on the base plate of one of the IGBTs is introduced. The heat flux experiments and the IGBT power losses obtained by simulations show similar results. The findings give clear evidence that the GHFS can provide an attractive condition monitoring method for the thermal loading of power devices.

Suggested Citation

  • Elvira Baygildina & Liudmila Smirnova & Kirill Murashko & Raimo Juntunen & Andrey Mityakov & Mikko Kuisma & Olli Pyrhönen & Pasi Peltoniemi & Katja Hynynen & Vladimir Mityakov & Sergey Sapozhnikov, 2016. "Application of a Heat Flux Sensor in Wind Power Electronics," Energies, MDPI, vol. 9(6), pages 1-14, June.
    • Handle: RePEc:gam:jeners:v:9:y:2016:i:6:p:456-:d:71997
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