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Analysis of Key Factors Affecting Case-to-Ambient Thermal Resistance in Thermal Modeling of Power Devices

Author

Listed:
  • Kaixin Wei

    (School of Automobile and Transportation, Tianjin University of Technology and Education, 1310 Dagu South Road, Hexi District, Tianjin 300222, China
    State Key Laboratory of Engines, Tianjin University, 135 Ya Guan Road, Jinnan District, Tianjin 300350, China)

  • Peiji Shi

    (School of Automobile and Transportation, Tianjin University of Technology and Education, 1310 Dagu South Road, Hexi District, Tianjin 300222, China)

  • Pili Bao

    (School of Automobile and Transportation, Tianjin University of Technology and Education, 1310 Dagu South Road, Hexi District, Tianjin 300222, China)

  • Chuanchao Liu

    (CIMC Safeway Technologies Co., Ltd., No. 159 Cheng Gang Road, Nantong 226003, China)

  • Yanzhou Qin

    (State Key Laboratory of Engines, Tianjin University, 135 Ya Guan Road, Jinnan District, Tianjin 300350, China)

Abstract

In the application of power converters, the ambient temperature ( T a ) experiences significant fluctuations. For the case-to-ambient resistance ( R ca ), apart from the influence of the material’s inherent properties, factors such as heat dissipation structure, working environment, and operational state can all have an impact on the R ca . Notably, while there are a limited number of models that consider environmental changes, existing models for calculating the R ca predominantly overlook the influence of varying working conditions or boundary conditions on the self-thermal resistance. Based on simulation and experimental analyses, the methods to calculate the R ca are outlined, and the key factors, inclusive of the coupling effects that influence the R ca in the thermal modeling of power devices, are thoroughly discussed.

Suggested Citation

  • Kaixin Wei & Peiji Shi & Pili Bao & Chuanchao Liu & Yanzhou Qin, 2024. "Analysis of Key Factors Affecting Case-to-Ambient Thermal Resistance in Thermal Modeling of Power Devices," Energies, MDPI, vol. 17(22), pages 1-14, November.
    • Handle: RePEc:gam:jeners:v:17:y:2024:i:22:p:5692-:d:1520807
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