IDEAS home Printed from https://ideas.repec.org/a/gam/jeners/v17y2024i17p4498-d1473680.html
   My bibliography  Save this article

Effect of Interface Defects on the Electric–Thermal–Stress Coupling Field Distribution of Cable Accessory Insulation

Author

Listed:
  • Xu Lu

    (Shenzhen Power Supply Bureau Co., Ltd., Shenzhen 518001, China)

  • Ran Hu

    (Shenzhen Power Supply Bureau Co., Ltd., Shenzhen 518001, China)

  • Kongying Guo

    (College of Automation and Electronic Engineering, Qingdao University of Science and Technology, Qingdao 266042, China)

  • Rui Lan

    (College of Automation and Electronic Engineering, Qingdao University of Science and Technology, Qingdao 266042, China)

  • Jie Tian

    (Shenzhen Power Supply Bureau Co., Ltd., Shenzhen 518001, China)

  • Yanhui Wei

    (College of Automation and Electronic Engineering, Qingdao University of Science and Technology, Qingdao 266042, China)

  • Guochang Li

    (College of Automation and Electronic Engineering, Qingdao University of Science and Technology, Qingdao 266042, China)

Abstract

The combined insulation interface of a high-voltage cable and accessories is the weakest part of a cable system. In this paper, the parameters of the dielectric constant, thermal conductivity, and elastic modulus of cross-linked polyethylene (XLPE) and silicone rubber (SIR) are obtained experimentally. On this basis, the model of a specific type of 110 kV cable and prefabricated insulation joint is established. A simulation of the electric–thermal–stress coupling field in the presence of typical defects in the main insulation–inner semi-conductive (SEMI) shielding layer (XLPE/SEMI interface) and the main insulation–silicone rubber insulation layer (XLPE/SIR interface) is studied. The simulation results show that at the XLPE/SIR interface, the electric field distortion caused by bubble defects reached 20.17 kV/mm, and the temperature rose to 56.15 °C. The effect of air-gap defects on the interface is similar to that of bubble defects. In addition, the semi-conductive impurity defects induced an increase in temperature to 56.82 °C and an increase in stress to 0.32 MPa. At the XLPE/SEMI interface, the electric field distortion induced by bubble defects was 19.98 kV/mm, and the temperature rose to 61.72 °C. The electric field distortion caused by metallic and semi-conductive defects was 8.44 kV/mm and 8.64 kV/mm, respectively. This study serves as a reference for the fault analysis and the operation and maintenance of cable accessories.

Suggested Citation

  • Xu Lu & Ran Hu & Kongying Guo & Rui Lan & Jie Tian & Yanhui Wei & Guochang Li, 2024. "Effect of Interface Defects on the Electric–Thermal–Stress Coupling Field Distribution of Cable Accessory Insulation," Energies, MDPI, vol. 17(17), pages 1-15, September.
  • Handle: RePEc:gam:jeners:v:17:y:2024:i:17:p:4498-:d:1473680
    as

    Download full text from publisher

    File URL: https://www.mdpi.com/1996-1073/17/17/4498/pdf
    Download Restriction: no

    File URL: https://www.mdpi.com/1996-1073/17/17/4498/
    Download Restriction: no
    ---><---

    References listed on IDEAS

    as
    1. Yi Luo & Zhengyi Han & Mingyu Zhou & Haitian Wang, 2020. "A Sophisticated Method of the Mechanical Design of Cable Accessories Focusing on Interface Contact Pressure," Energies, MDPI, vol. 13(11), pages 1-16, June.
    Full references (including those not matched with items on IDEAS)

    Most related items

    These are the items that most often cite the same works as this one and are cited by the same works as this one.
    1. Thi Thu Nga Vu & Gilbert Teyssedre & Séverine Le Roy, 2021. "Electric Field Distribution in HVDC Cable Joint in Non-Stationary Conditions," Energies, MDPI, vol. 14(17), pages 1-17, August.

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:gam:jeners:v:17:y:2024:i:17:p:4498-:d:1473680. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    If CitEc recognized a bibliographic reference but did not link an item in RePEc to it, you can help with this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: MDPI Indexing Manager (email available below). General contact details of provider: https://www.mdpi.com .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.