Biomimetic Copper Forest Structural Modification Enhances the Capillary Flow Characteristics of the Copper Mesh Wick

In a two-phase heat transfer device, achieving a high capillarity of the wick while reducing flow resistance within a limited space becomes the key to improving the heat dissipation performance. As a commonly used wick structure, mesh is widely employed because of its high permeability. However, achieving the desired capillary performance often requires multiple layers to be superimposed to ensure an adequate capillary, resulting in an increased thickness of the wick. In this study, an ultra-thin biomimetic copper forest structural modification of copper mesh was performed using an electrochemical deposition to solve the contradiction between the permeability and the capillary. The experiments were conducted on a copper mesh to investigate the effects of various conditions on their morphology and capillary performance. The results indicate that the capillary performance of the modified copper mesh improves with a longer deposition time. The capillary pressure drops can reach up to 1400 Pa when using ethanol as the working fluid. Furthermore, the modified copper mesh demonstrates a capillary performance value (Δ P c ·K ) of 8.44 × 10 −8 N, which is 1.7 times higher than that of the unmodified samples. Notably, this enhanced performance is achieved with a thickness of only 142 μm. The capillary limit can reach up to 45 W when the modified copper mesh is only 180 μm. Microscopic flow analysis reveals that the copper forest modified structure maintains the original high permeability of the copper mesh while providing a greater capillary force, thereby enhancing the overall flow characteristics.