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Structural Analysis of Power Devices and Assemblies by Thermal Transient Measurements

Author

Listed:
  • Gabor Farkas

    (Mentor, a Siemens business, Mechanical Analysis Division, Gábor Dénes utca 2, 1117 Budapest, Hungary)

  • Zoltan Sarkany

    (Mentor, a Siemens business, Mechanical Analysis Division, Gábor Dénes utca 2, 1117 Budapest, Hungary
    Department of Electron Devices, Budapest University of Technology and Economics, Magyar tudósok körútja 2, bldg. Q, 1117 Budapest, Hungary)

  • Marta Rencz

    (Mentor, a Siemens business, Mechanical Analysis Division, Gábor Dénes utca 2, 1117 Budapest, Hungary
    Department of Electron Devices, Budapest University of Technology and Economics, Magyar tudósok körútja 2, bldg. Q, 1117 Budapest, Hungary)

Abstract

Power modules composed of semiconductor dice, thermal interface layers, and cooling mounts can be characterized by thermal transient testing at their actual position (in situ). This paper demonstrates that transient testing enables tracking of changes in material quality and structural details on the raw heating or cooling curves. Higher precision can be achieved with the structure function technique where absolute and partial thermal resistance and capacitance values can be used for unambiguous identification of structural elements in a heat conducting path. Measurement techniques are presented to characterize the self-heating of a die and heat transfer between dice. Change of the thermal interface material layers in assembly during test sequences is also highlighted by the structure function concept. The power distribution between dice and wiring is analyzed by the newly introduced “accordion” principle.

Suggested Citation

  • Gabor Farkas & Zoltan Sarkany & Marta Rencz, 2019. "Structural Analysis of Power Devices and Assemblies by Thermal Transient Measurements," Energies, MDPI, vol. 12(14), pages 1-22, July.
    • Handle: RePEc:gam:jeners:v:12:y:2019:i:14:p:2696-:d:248395
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    Citations

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    Cited by:

    1. Zoltan Sarkany & Marta Rencz, 2020. "Methods for the Separation of Failure Modes in Power-Cycling Tests of High-Power Transistor Modules Using Accurate Voltage Monitoring," Energies, MDPI, vol. 13(11), pages 1-18, May.
    2. Gabor Farkas & Dirk Schweitzer & Zoltan Sarkany & Marta Rencz, 2020. "On the Reproducibility of Thermal Measurements and of Related Thermal Metrics in Static and Transient Tests of Power Devices," Energies, MDPI, vol. 13(3), pages 1-29, January.

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