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Study on Insulation Breakdown Characteristics of Printed Circuit Board under Continuous Square Impulse Voltage

Author

Listed:
  • Quan Zhou

    (State Key Laboratory of Power Transmission Equipment & System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing 400044, China)

  • Mingqian Wen

    (State Key Laboratory of Power Transmission Equipment & System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing 400044, China)

  • Taotao Xiong

    (State Grid Chengdu Power Supply Company, Chengdu 610000, China)

  • Tianyan Jiang

    (School of Electrical and Electronic Engineering, Chongqing University of Technology, Chongqing 400050, China)

  • Ming Zhou

    (State Key Laboratory of Power Transmission Equipment & System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing 400044, China)

  • Xi Ouyang

    (State Key Laboratory of Power Transmission Equipment & System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing 400044, China)

  • Lai Xing

    (State Key Laboratory of Power Transmission Equipment & System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing 400044, China)

Abstract

The widely distributed interconnects in printed circuit boards (PCBs) easily couple with high voltage under the action of electromagnetic pulses, which leads to insulation failure. In this study, the dielectric breakdown characteristics of four typical PCBs are studied under continuous square impulse voltage conditions. First, the electric field distribution in the four electrode models is simulated with the ANSYS software (ANSYS Maxwell 17.0). Electric field simulation results show the weak area of electric field distribution. On this basis, the possible breakdown patterns of PCB are analyzed. Second, the influence of factors, such as temperature, pulse duty ratio, interconnect insulation distance, and air pressure, on PCB breakdown voltage is studied through a breakdown test on the PCBs. Results show that the discharge between the single-layer electrodes of the PCBs is surface discharge, and the breakdown is that of a “gas–solid composite medium”. Meanwhile, the breakdown of a double-layer PCB is solid breakdown. Finally, scanning electron microscopy (SEM) produced by Tescan (Brno, Czech Republic) is performed to study the carbonization channel after PCB breakdown. SEM results reveal that the PCB carbonization channel is influenced by temperature and pressure in varying degrees.

Suggested Citation

  • Quan Zhou & Mingqian Wen & Taotao Xiong & Tianyan Jiang & Ming Zhou & Xi Ouyang & Lai Xing, 2018. "Study on Insulation Breakdown Characteristics of Printed Circuit Board under Continuous Square Impulse Voltage," Energies, MDPI, vol. 11(11), pages 1-13, October.
    • Handle: RePEc:gam:jeners:v:11:y:2018:i:11:p:2908-:d:178311
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    Cited by:

    1. Suziana Ahmad & Reiji Hattori & Aam Muharam, 2021. "Generalized Circuit Model of Shielded Capacitive Power Transfer," Energies, MDPI, vol. 14(10), pages 1-19, May.

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