Study on the Hole-Forming Performance and Opening of Mulching Film for a Dibble-Type Transplanting Device

In order to improve the quality of transplanting devices and solve the problems of the poor effect on soil moisture conservation and more weeds easily growing due to the high mulching-film damage rate with an excessive number of hole openings, we developed a dibble-type transplanting device consisting of a dibble-type transplanting unit, a transplanting disc, and a dibble axis. The ADAMS software Adams2020 (64bit) was used to simulate and analyze the kinematic track of the transplanting device. The results of the analysis show that, when the hole opening of the envelope in the longitudinal dimension was the smallest, the transplanting characteristic coefficient was 1.034, the transplanting angle was 95°, and the transplanting frequency had no influence. With the help of the ANSYS WORKBENCH software Ansys19.2 (64bit), an analysis of the process of the formation of an opening in the mulching film and a mechanical simulation of this process were completed. The results indicate that, when the maximum shear stress of the mulching film was the smallest, the transplanting characteristic coefficient was 1.000, the transplanting frequency was 36 plants·min −1 , and the transplanting angle was 95°. In addition, the device was tested in a film-breaking experiment on a soil-tank test bench to verify the hole opening in the mulching film. The bench test showed that, when the longitudinal dimension was the smallest, the transplanting characteristic coefficient was 1.034, the transplanting frequency was 36 plants·min −1 , and the transplanting angle was 95°. When the lateral dimension was the smallest, the transplanting characteristic coefficient was 1.034, the transplanting frequency was 36 plants·min −1 , and the transplanting angle was 90°. The theoretical analysis, kinematic simulation, and soil-tank test results were consistent, verifying the validity and ensuring the feasibility of the transplanting device. This study provides a reference for the development of transplanting devices.