IDEAS home Printed from https://ideas.repec.org/a/eee/techno/v140y2025ics0166497224002050.html
   My bibliography  Save this article

Overcoming institutional divides: Historical ties, economic integration policies, and the selection of partners for international technological alliances

Author

Listed:
  • Krammer, Sorin M.S.

Abstract

While management research documents a strong negative effect of institutional distance on cross-border interactions, we know relatively little about whether and how firms can overcome this snag. Using transaction costs and institutional arguments we posit that the negative effect of institutional distance on selection of international alliance partners will be weaken by the extent of informal (i.e., colonial duration) and formal (i.e., economic integration policies) ties between home-countries of prospective partners. The relative strength of these ties will reduce uncertainty and risks, as well as provide better mutual knowledge of partners’ cognitive, normative, and regulatory backgrounds. Empirical results based on a panel of firms in the global tire industry and addressing endogeneity issues confirm these predictions. Our findings offer a more comprehensive view of international partner selection for alliances, attesting the role of institutions in this process and their interplay with the macro context of organizations which includes historical links and current economic policies.

Suggested Citation

  • Krammer, Sorin M.S., 2025. "Overcoming institutional divides: Historical ties, economic integration policies, and the selection of partners for international technological alliances," Technovation, Elsevier, vol. 140(C).
    • Handle: RePEc:eee:techno:v:140:y:2025:i:c:s0166497224002050
    DOI: 10.1016/j.technovation.2024.103155
    as

    Download full text from publisher

    File URL: http://www.sciencedirect.com/science/article/pii/S0166497224002050
    Download Restriction: Full text for ScienceDirect subscribers only
    File URL: https://libkey.io/10.1016/j.technovation.2024.103155?utm_source=ideas
    LibKey link: if access is restricted and if your library uses this service, LibKey will redirect you to where you can use your library subscription to access this item
    ---><---

    As the access to this document is restricted, you may want to search for a different version of it.

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:eee:techno:v:140:y:2025:i:c:s0166497224002050. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Catherine Liu (email available below). General contact details of provider: http://www.sciencedirect.com/science/journal/01664972 .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.