Applications of low melting point alloy for electronic thermal management: A review

Due to the high thermal conductivity and large latent heat, low melting point alloy (LMPA) exhibits superior thermophysical properties when using as phase change material (PCM). Meanwhile, the adoption of LMPA in renewable energy systems supports the sustainable development goal of promoting energy efficiency and mitigating climate impact. This paper synthesizes the effect of LMPA thermal properties as well as their merits on thermal management system (TMS) evaluation criteria are comprehensively reviewed, highlighting their potential to improve energy efficiency and system reliability. The applications of LMPA-based TMS using for passive and hybrid cooling strategies are respectively discussed based on published literatures. For passive cooling systems, LMPA could be applied as thermal buffer in chip- and heat sink-level. Moreover, in hybrid cooling systems, the TMS performance could be enhanced by applying LMPA, coupling with components such as heat pipe/vapor chamber, active cooling systems and some other driven devices. The merits, operating conditions and typical setups of LMPA-based TMS are also detailly introduced. In contrast, the demerits of LMPA such as expansion and corrosion and various evaluation criteria are summarized. As the result, the evaluation on material-level and system-level thermal management performance is highlighted, which remains to be further explored. The challenges of fully exhibiting LMPA advantages in the TMS for electronic devices based on existed studies are proposed. By bridging the gap between materials science and energy sustainability, this study provides insights into future directions for incorporating LMPAs into broader energy-efficient thermal management systems, aligning with global energy transition goals.