IDEAS home Printed from https://ideas.repec.org/a/eee/matcom/v61y2003i3p209-218.html
   My bibliography  Save this article

Finite element simulation of thermoforming processes for polymer sheets

Author

Listed:
  • Warby, M.K.
  • Whiteman, J.R.
  • Jiang, W.-G.
  • Warwick, P.
  • Wright, T.

Abstract

The problem of modelling and the finite element simulation of thermoforming processes for polymeric sheets at various temperatures and for different loading regimes is addressed. In particular, the vacuum forming process for sheets at temperatures of approximately 200°C and the Niebling process for sheets at temperature of 100°C with high pressure loading are both described. Discussion is given to the assumptions made concerning the behaviour of the polymers and the physical happenings in the process in order that realistic models of the inflation part of each process may be produced. Stress–strain curves produced from experimental testing of BAYFOL® at various strain rates and temperatures are presented. A model for the elastic–plastic deformation of BAYFOL® is described and is used within the finite element framework to simulate the inflation part of the Niebling process. Numerical results for the deformation of sheets into a mould in the Niebling context are presented.

Suggested Citation

  • Warby, M.K. & Whiteman, J.R. & Jiang, W.-G. & Warwick, P. & Wright, T., 2003. "Finite element simulation of thermoforming processes for polymer sheets," Mathematics and Computers in Simulation (MATCOM), Elsevier, vol. 61(3), pages 209-218.
  • Handle: RePEc:eee:matcom:v:61:y:2003:i:3:p:209-218
    as

    Download full text from publisher

    File URL: http://www.sciencedirect.com/science/article/pii/S0378475402000770
    Download Restriction: Full text for ScienceDirect subscribers only
    ---><---

    As the access to this document is restricted, you may want to search for a different version of it.

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:eee:matcom:v:61:y:2003:i:3:p:209-218. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Catherine Liu (email available below). General contact details of provider: http://www.journals.elsevier.com/mathematics-and-computers-in-simulation/ .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.