Thermal management enhancement of electronic chips based on novel technologies

As the characteristic size continue to decrease and integration and output power continue to increase, the heat flow density of electronic chips and the risk of thermal failure increase dramatically. Effectively dissipating the heat generated during the working process of electronic chips and realizing efficient thermal management under high heat flow density conditions has become a focal point of interest for both academia and industry. This paper focuses on the embedded microchannel two-phase cooling technology. It analyzes and summarizes the latest technological and research advances in industry and academia in the field of thermal management of electronic chips from three aspects: embedded cooling, microchannel cooling, and two-phase cooling. It sorts out the logical relationship between these three perspectives, and combs through the key scientific issues, bottlenecks and challenges, and future development directions and prospects. First, there is a move from non-embedded cooling to embedded cooling. The heat dissipation capacity is gradually increasing from 200 W/cm2 to more than 1000 W/cm2. Second, there is a move from conventional channels to microchannels. Hydraulic diameters gradually shrinking to 3 mm, 200 μm, 1 μm, and even within 1 μm. Finally, there is a move from single-phase cooling to two-phase cooling. Utilizing the latent heat of phase change to further enhance the heat transfer efficiency. We believe that in the future, the design of microchannel structure and the optimization of heat transfer surface can be fully integrated with bionics, adaptive regulation, machine learning, and other novel technologies to further achieve heat transfer enhancement and improve the potential of thermal management of electronic chips.