IDEAS home Printed from https://ideas.repec.org/a/eee/appene/v56y1997i1p71-91.html
   My bibliography  Save this article

Horizontal simulated printed-circuit board assembly in fully-developed laminar-flow convection

Author

Listed:
  • Leung, C. W.
  • Kang, H. J.
  • Probert, S. D.

Abstract

Steady-state convective heat-transfer and pressure-drop characteristics for laminar air-flows over a horizontally-orientated simulated printed-circuit board (PCB) assembly have been measured experimentally and predicted numerically. The considered assembly consisted of a plate with uniformly-spaced identical electrically-heated rectangular uniform ribs mounted orthogonal to the mean air-flow. Mathematical correlations were determined between the cavity-height to ribs' protrusion and width-to-protrusion ratios, namely (H/B) and (L/B), respectively, and the Reynolds number (Rec) of the air-flow with the steady-state Nusselt number (Nuc) and friction factor (fc), both of these latter parameters being highly dependent on H/B. When H/B>=8, natural convection provided a significant portion of the total rate of heat transfer, and mixed (i.e. forced plus natural) convection ensued. For assemblies with ribs each of the same volume, the assembly with the ribs having a larger top surface-area has the higher heat-transfer coefficient and smaller pressure drop under otherwise identical conditions.

Suggested Citation

  • Leung, C. W. & Kang, H. J. & Probert, S. D., 1997. "Horizontal simulated printed-circuit board assembly in fully-developed laminar-flow convection," Applied Energy, Elsevier, vol. 56(1), pages 71-91, January.
  • Handle: RePEc:eee:appene:v:56:y:1997:i:1:p:71-91
    as

    Download full text from publisher

    File URL: http://www.sciencedirect.com/science/article/pii/S0306-2619(97)00001-9
    Download Restriction: Full text for ScienceDirect subscribers only
    ---><---

    As the access to this document is restricted, you may want to search for a different version of it.

    References listed on IDEAS

    as
    1. Tam, W. C. & Leung, C. W. & Probert, S. D., 1993. "Forced convective air-cooling of simulated printed-circuit boards," Applied Energy, Elsevier, vol. 46(3), pages 197-214.
    Full references (including those not matched with items on IDEAS)

    Citations

    Citations are extracted by the CitEc Project, subscribe to its RSS feed for this item.
    as


    Cited by:

    1. Li, Qi & Flamant, Gilles & Yuan, Xigang & Neveu, Pierre & Luo, Lingai, 2011. "Compact heat exchangers: A review and future applications for a new generation of high temperature solar receivers," Renewable and Sustainable Energy Reviews, Elsevier, vol. 15(9), pages 4855-4875.

    Most related items

    These are the items that most often cite the same works as this one and are cited by the same works as this one.
    1. Leung, C. W. & Chan, T. L. & Probert, S. D. & Kang, H. J., 1999. "Forced convection from a horizontal ribbed rectangular base-plate penetrated by arrays of holes," Applied Energy, Elsevier, vol. 62(2), pages 81-95, February.

    More about this item

    Statistics

    Access and download statistics

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:eee:appene:v:56:y:1997:i:1:p:71-91. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    If CitEc recognized a bibliographic reference but did not link an item in RePEc to it, you can help with this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Catherine Liu (email available below). General contact details of provider: http://www.elsevier.com/wps/find/journaldescription.cws_home/405891/description#description .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.