IDEAS home Printed from https://ideas.repec.org/a/eee/appene/v384y2025ics030626192500114x.html
   My bibliography  Save this article

Investigation of heat pump technologies for high-temperature applications above 250 °C

Author

Listed:
  • Yoo, JunSoo
  • Estrada-Perez, Carlos E.
  • Choi, Byung-Hee

Abstract

This paper examines heat pump (HP) technologies to achieve heat supply temperatures above 250 °C, referred to as ultra-high-temperature heat pump (UHTHP). UHTHP, as a low-carbon heat delivery and heat augmentation technology, can offer an alternative to traditional combustion heating for decarbonizing high-temperature industrial processes. However, the heat supply temperature of over 250 °C surpasses the temperature range typically covered in the high-temperature HP literature and existing capabilities of commercial HP systems. This paper reviews HP technologies with the potential to evolve into UHTHP. Additionally, UHTHP studies in the literature are analyzed to compare the pros, cons, and technical potentials of various HPs using different thermodynamic cycles and fluids. We then pinpoint the technical gaps and challenges that have hindered widespread adoption of UHTHP in industry, explore potential improvements and solutions, and discuss the feasibility. Current efforts aim to lay the ground for future research, development, and commercial deployment for UHTHP.

Suggested Citation

  • Yoo, JunSoo & Estrada-Perez, Carlos E. & Choi, Byung-Hee, 2025. "Investigation of heat pump technologies for high-temperature applications above 250 °C," Applied Energy, Elsevier, vol. 384(C).
    • Handle: RePEc:eee:appene:v:384:y:2025:i:c:s030626192500114x
    DOI: 10.1016/j.apenergy.2025.125384
    as

    Download full text from publisher

    File URL: http://www.sciencedirect.com/science/article/pii/S030626192500114X
    Download Restriction: Full text for ScienceDirect subscribers only
    File URL: https://libkey.io/10.1016/j.apenergy.2025.125384?utm_source=ideas
    LibKey link: if access is restricted and if your library uses this service, LibKey will redirect you to where you can use your library subscription to access this item
    ---><---

    As the access to this document is restricted, you may want to search for a different version of it.

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:eee:appene:v:384:y:2025:i:c:s030626192500114x. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Catherine Liu (email available below). General contact details of provider: http://www.elsevier.com/wps/find/journaldescription.cws_home/405891/description#description .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.