Assessing a Hierarchical Structure for Circular Supply Chain Management Performance: Improving Firms' Eco‐Innovation and Technological Performance

This study develops and assesses the validity of a hierarchical structure for circular supply chain management performance (CSCMP) in the semiconductor industry. Previous studies have focused on synchronizing technological performance with eco‐innovation to enhance the circular operations, financial benefits, environmental advantages, and social benefits of CSCMP. This study employs a hybrid data–driven approach that combines qualitative and quantitative techniques to develop a hierarchical structure and determine the ranks of various attributes, thereby providing decision‐makers with valuable insights and practical guidance. Content and bibliographic analyses, the entropy‐weighted method, the fuzzy Delphi method, exploratory factor analysis, fuzzy decision‐making trials, evaluation laboratories, and fuzzy analytic network processes are incorporated in this data‐driven approach. The findings of this research suggest that stakeholders must collaborate to improve eco‐innovation and technological performance with the goal of enhancing CSCMP. Decision‐makers must prioritize stakeholder engagement, risk and responsibility sharing, and collaboration within the circular supply chain. Additionally, service innovations and network innovations can enhance the circularity model.