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A New Model for Temperature Jump at a Fluid-Solid Interface

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  • Jian-Jun Shu
  • Ji Bin Melvin Teo
  • Weng Kong Chan

Abstract

The problem presented involves the development of a new analytical model for the general fluid-solid temperature jump. To the best of our knowledge, there are no analytical models that provide the accurate predictions of the temperature jump for both gas and liquid systems. In this paper, a unified model for the fluid-solid temperature jump has been developed based on our adsorption model of the interfacial interactions. Results obtained from this model are validated with available results from the literature.

Suggested Citation

  • Jian-Jun Shu & Ji Bin Melvin Teo & Weng Kong Chan, 2016. "A New Model for Temperature Jump at a Fluid-Solid Interface," PLOS ONE, Public Library of Science, vol. 11(10), pages 1-12, October.
    • Handle: RePEc:plo:pone00:0165175
    DOI: 10.1371/journal.pone.0165175
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